
供應(yīng)SOI絕緣硅片
特博科技有限公司是英國ICEMOSTECH公司在中國的獨家代理,高品質(zhì)的SOI wafer和
SuperJunction MOSFET是ICEMOS的主營產(chǎn)品,憑借15年的制造經(jīng)驗ICEMOS在世界范圍內(nèi)有著
眾多的客戶群體,分別在歐洲,美國,日本、韓國和中東設(shè)有代理商。
SOI wafer尺寸: 4”(100mm), 5”(125mm), 6”(150mm) and 8"(200mm)
SOI Spec. 規(guī)格:
1- Bonded SOI wafer (絕緣硅上鍵合硅片)
For 4”(100mm), 5”(125mm), 6”(150mm)
---- Handle wafer minimum 300um maximum 1000um,
---- Buried Oxide, minimum 0.1 um, maximum 4 um,
---- Device layer minimum 2 um, max 500 um.
For 8"(200mm)
---- Handle thickness minimum 500um and maximum 675um,
---- Buried Oxide minimum 0.1 um, maximum 4 um,
---- Device layer minimum 5 um, maximum 500 um.
2- Si-Si direct wafer bonding (replacement for epi) 硅-硅直接鍵合,可替代外延片
100mm, 125mm, 150mm and 200mm, thickness as specified above.
3- Engineered SOI, Double SOI (DSOI), Trench Isolation SOI (dielectric isolation),
Cavity SOI (for pressure sensor, gyro and accelerometer sensor, microfludic etc.)
and finally Through Silicon Via (TSV)
---- Cavity SOI - Bonded SOI or Silicon silicon DWB wafers with cavities performed within the wafer
---- Multiple SOI 2 or 3 or more layers of SOI designed around your process
---- Structured wafers silicon wafers or SOI with buried electrode layers, vias, interconnect already incorporated
4- SOI + Trench & Refill
Features
? Significant die shrink compared to conventional dielectric isolation
(DI) or junction isolation
? Bulk quality top silicon layer
? Total device-to-device isolation
? Lower substrate capacitance than bulk
? Fully flexible specification on SOI, Trench and refill parameters
5- Superjunction MOSFET
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